RF & Microwave Passive Component Simulation

This note uses the RF & Microwave module to simulate a printed Wilkinson power divider at 9 GHz, computing S-parameters, power split balance, return loss and isolation over 4–12 GHz.

This application note uses EMWorks to model a compact 1.8 GHz planar crossover built from coupled lines with open stubs on a dielectric substrate. S-parameter results show return loss, transmission, and isolation performance, correlating simulation and measurement for IC and antenna array applications.

This application note studies a folded H-plane waveguide RF power divider at 3.7 GHz using 3D simulation. It evaluates S-parameters, electric field distribution, temperature rise, and thermally induced stress to assess power handling limits and the need for forced cooling in high-power operation.

This application note presents the design and 3D full-wave analysis of a compact planar microstrip crossover intended for monolithic ICs and antenna arrays at 2.4 GHz. The structure consists of a square microstrip patch with perpendicular rectangular and arc-shaped slots, fed by four orthogonal microstrip lines over a high-permittivity substrate. S-parameter results show a 12% bandwidth centered at 2.4 GHz, return loss better than 10 dB, insertion loss below 1 dB, and isolation above 13 dB. Simulated and measured data are in close agreement, confirming the crossover’s suitability for use in beam-forming and other multiport RF networks.